Semi Automatic Wedge Bonder:
This is a Bench Top Size Wire Bonder, ideal for laboratories, pilot and small scale production lines. One Bond Head for bonding in Ball/Wedge bonding mode. Only tool change necessary. It is operate with TFT touch screen and direct access and simple adjustment of all bond parameter.
Make & Model : TPT Wire Bonder GmBh Germany, HB 10
Installation Date : 19.03.2019
Current Location : Room no. – 04, Ground floor
Important Features of the System:
- Bonding Method: Wedge-Wedge, Ball-Wedge, Ribbon- Bonding.
- Gold wire diameter: 17-75µm (0,7 – 3").
- Aluminum wire diameter : 17-75µm (0,7 – 3").
- Ribbon size: max. 25 x 250 µm (1 x 9,8").
- Bond time 0-20000 msec.
- Temperature controller: up to 250 ̊C +/- 1 ̊C.
This Section will be updated soon.
Email: caif@iiserbpr.ac.in