Semi Automatic Wedge Bonder:

Spectrometer With TCSPC System
This is a Bench Top Size Wire Bonder, ideal for laboratories, pilot and small scale production lines. One Bond Head for bonding in Ball/Wedge bonding mode. Only tool change necessary. It is operate with TFT touch screen and direct access and simple adjustment of all bond parameter.

Make & Model : TPT Wire Bonder GmBh Germany, HB 10
Installation Date : 19.03.2019
Current Location : Room no. – 04, Ground floor

Important Features of the System:

  1. Bonding Method: Wedge-Wedge, Ball-Wedge, Ribbon- Bonding.
  2. Gold wire diameter: 17-75µm (0,7 – 3").
  3. Aluminum wire diameter : 17-75µm (0,7 – 3").
  4. Ribbon size: max. 25 x 250 µm (1 x 9,8").
  5. Bond time 0-20000 msec.
  6. Temperature controller: up to 250 ̊C +/- 1 ̊C.

This Section will be updated soon.

Email: caif@iiserbpr.ac.in